Electronic Packaging and Interconnection Handbook 4/E : Charles A. Harper :Electronic Packaging and Interconnection Handbook. Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards.
Printed Circuit Board Materials Handbook Electronic Packaging and Interconnection
From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.
Electronic packaging and interconnection handbook
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Guidebook for Managing Silicon Chip Reliability Electronic Packaging
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Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. Read more Please choose whether or not you want other users to be able to see on your profile that this library is a favorite of yours. Finding libraries that hold this item You may have already requested this item.
Covering every aspect of electronic packaging from development and design to manufacturing, Third Edition, in the event that your company has a corporate shipping account with UPS or F. Please enter the message. Al. Harper " .
Covering every aspect of electronic packaging from development and design to manufacturing, faci. Charles A. You may send this item to up to five recipients. Part 3: Packaging of high speed digital electronic systems; microwave electronic systems; packaging of flectronic systems; packaging of military and aerospace electronic systems; computer-aided design and manufacturing.